In-die Solutions

Working “In-Die” is no longer only desirable, but essential as the measurement of test structures no longer reflects the complex interactions that are taking place between patterns and illuminating light in the deep sub-wavelength regime. For this reason Carl Zeiss SMS provides systems for the measurement of parameters such as Phase Shift, Registration and Actinic CD measurement at the wafer level, all of which have the capability to measure within the active area of the design. Besides in-die metrology also repairing structures in-die and tuning mask properties in the production area is a striking feature against conventional methods.

ZERO Defect With smaller feature sizes mask defects become more and more critical. Carl Zeiss provides a unique solution for mask defect analysis, repair and repair verification to ensure zero-defect mask manufacturing. Read more

In-die Metrology For advanced lithography applications in-die metrology is key for sustainable yield. Carl Zeiss provides a suite of metrology tools capable of measuring in-die features. Read more

CD Control One of the key parameters to assure the functionality of ICs is the Critical Dimension Uniformity. Carl Zeiss provides a unique solution to measure and improve one main contributor to Wafer CDU — the Mask CDU. Read more