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ZEISS Xradia 515 Versa

3D 서브 마이크론 이미징을 위한 최상의 장비

ZEISS Xradia 510 Versa

Break the one micron resolution barrier with this X-ray microscope for 3D imaging and in situ / 4D investigations.

Use the combination of resolution and contrast with flexible working distances to extend the power of non-destructive imaging in your lab.

Benefit from its architecture that uses a two-stage magnification technique to achieve submicron resolution at a distance (RaaD). Reducing dependence upon geometric magnification maintains submicron resolution even at large working distances.

Highlights

Enjoy versatility even at large working distances from the source - from millimeters to centimeters.
 
  • Perform 3D Imaging for soft or low-Z materials with advanced absorption and innovative phase contrast
  • Achieve world-leading resolution at flexible working distances beyond the limits of projection-based micro-CT
  • Resolve submicrometer-scaled features for diverse sample sizes
  • Extend non-destructive imaging in your lab with an in situ / 4D solution
  • Investigate materials in native-like environments over time
  • Throughput with image quality

Application Examples

ZEISS Xradia 515 Versa

Materials Research

Typical tasks and applications
 
  • Visualizing cracks in soft composite materials or measuring porosity in steel
  • Perform in situ studies by imaging under varying conditions such as tensile, compression, gas, oxidation, wetting and temperature variations
  • Image materials that are incompatible with vacuum and charged particle beams
  • View into deeply buried microstructures that may be unobservable with 2D surface imaging such as optical microscopy, SEM, and AFM
  • Maintain resolution at a distance for in situ imaging experiments, allowing you to study a wide variety of sample sizes and shapes using various in situ apparatus
  • Understand the impact of these varying conditions over time with the non-destructive nature of X-rays
     
PEFC
PEFC

Application Video

Sintered Powder Steel

Non-destructive 3D imaging is crucial for additive manufacturing development. A powder stainless steel sample was laser-sintered and imaged by ZEISS Xradia Versa. From the 3D dataset, the non-sintered solid phase was virtually segmented and volume quantified. XRM also provides ability to do interior tomography and look at virtual cross-sections without damage to the sample. Sample courtesy of NIST.

Life Sciences

Typical tasks and applications
 
  • Perform histologies virtually and visualize cellular and subcellular features
  • Expand your views in developmental biology with high resolution, high contrast images of cellular and subcellular structures
  • Image large intact samples such as brains or large bones
  • Achieve high resolution and high contrast for unstained and stained tissue
  • Investigate hard and soft tissues and biological microstructures
Dental implant © Sunita Ho, UCSF, California
Dental implant

Raw Materials

Typical tasks and applications
 
  • Characterize heterogeneity at core plug scale and quantify pore structures
  • Measure fluid flow, analyze texture, and understand dimensional classification
  • Study carbon sequestration efforts
  • Advance mining processes: analyze tailings to maximize mining efforts; conduct thermodynamic leaching studies; perform QA/QC analysis of mining products such as iron ore pellets
  • Benefit from getting the most accurate 3D submicron support for digital rock simulations, in situ multiphase fluid flow studies, 3D mineralogy, and laboratory-based diffraction contrast tomography (LabDCT)
  • Perform multi-scale imaging, characterization and modeling of large (4" core) samples at high throughput
Shale heterogeneity
Shale heterogeneity

Electronics

Typical tasks and applications
 
  • Optimize your process development and analyze failures by using non-destructive submicron imaging of intact packages for defect localization and characterization
  • Measure buried features in three dimensions or study package reliability
  • Benefit from high resolution and non-destructive imaging for 3D submicron imaging that complements or replaces physical cross sectioning methods
  • Work efficiently in a single tool workflow with high throughput macro-scanning of an intact device
  • Non-destructively scout-and-zoom from module to package to interconnect for submicron imaging of defect re-localization and characterization with a fast time to results that complements or replaces physical cross-sectioning
Flip chip bumps
Flip chip bumps

Accessories

ZEISS Advanced Reconstruction Toolbox

Better image quality, higher throughput

ZEISS Advanced Reconstruction Toolbox

Better image quality, higher throughput

What is Artificial Intelligence?
For more information click to enlarge the graphic
What is Artificial Intelligence?
For more information click to enlarge the graphic

Advanced Reconstruction Toolbox (ART) introduces Artificial Intelligence (AI)-driven reconstruction technologies on your ZEISS Xradia 3D X-ray microscope (XRM) or microCT. A deep understanding of both X-ray physics and applications enable you to solve some of the hardest imaging challenges in new and innovative ways.

Discover how speed of data acquisition and reconstruction as well as image quality are enhanced without sacrificing resolution by using OptiRecon, two variants of DeepRecon and PhaseEvolve, the unique modules of ART.

With the Advanced Reconstruction Toolbox, you are able to:

  • Improve data collection and analysis for accurate and faster decision-making
  • Greatly enhance image quality
  • Achieve superior interior tomography or throughput on a broad class of samples
  • Reveal subtle difference through improved contrast-to-noise
  • Increase speed at an order of magnitude for sample classes requiring repetitive workflow

 

3D X-ray dataset of a camera lens acquired using ZEISS Xradia 620 Versa and DeepRecon Pro.

ZEISS DeepRecon Pro provides a straightforward, uncomplicated, and powerful application of AI and deep neural network technology for enhancing X-ray tomography results without prior knowledge on deep learning technology. [...] It helps us to reduce the scan time required for in situ fluid-rock interaction experiments when we need to work with long exposure times.

Dr. Markus Ohl | X-Ray microscopy | EPOS-NL MINT | Utrecht University, NL

ZEISS DeepRecon Pro & Custom for Deep learning-based reconstruction

Increase the speed of your data acquisition with reconstruction technology

DeepRecon technology is offered in two forms - DeepRecon Pro and DeepRecon Custom - both leveraging AI and enhancing image quality and speed. Increase throughput without sacrificing RaaD (resolution-at-a-distance). Alternatively, keep the same number of projections and enhance the image quality further.

DeepRecon Pro used for throughput improvement for Ceramic Matrix Composite (CMC) sample, achieving 10× throughput improvement without sacrificing image quality. This would allow for much higher temporal resolution for in situ studies. Left: Standard reconstruction (FDK): Scan time 9 hrs (3001 projections). Center: Standard reconstruction (FDK): Scan time 53 mins (301 projections). Right: DeepRecon Pro: Scan time 53 mins (301 projections).

Find out the difference:

  • With DeepRecon Pro you benefit from superior throughput and image quality across a wide range of applications.
  • It enables you to reveal subtle differences in the images of your samples through improved contrast-to-noise.
  • Increase the speed of your data acquisition up to 10x for sample classes requiring a repetitive workflow.
  • Apply DeepRecon Pro to unique samples, to semi-repetitive and repetitive workflows.
  • Now you can self-train new machine learning network models on-site with an easy-to-use interface.
  • The need for a machine learning expert is thus eliminated and DeepRecon Pro can be seamlessly operated by even a novice user.
  • ZEISS DeepRecon Custom is targeted specifically for repetitive workflow applications to further boost XRM performance beyond DeepRecon Pro.
  • ZEISS collaborates closely with users to develop custom-created network models that fit their repetitive application needs precisely.

Application Examples

Ceramic Matrix Composite (CMC) - 10X Throughput Improvement

10X throughput improvement without sacrificing image quality.

Smartwatch Battery - 4X Throughput Improvement

4X throughput improvement while maintaining detail in cathode particles.

Smartwatch Battery - Image Quality Improvement

Enhanced image quality to see low contrast graphite particles

21700 Cylindrical Cell Battery - 8X Throughput Improvement

8X throughput improvement with comparable image quality

2.5D Semiconductor Interposer Package – 4X Throughput Improvement

4X throughput improvement while retaining 1 µm crack

2.5D Semiconductor Interposer Package – Improved Image Quality

Improved image quality with same scan time.

Sandstone Core – 6X Throughput Improvement

6X throughput improvement with improved image quality and reduced imaging artefact in the imaging of sandstone rock cores enables more accurate segmentation, quantification and simulation.

ZEISS OptiRecon for iterative reconstruction

Similar results, 4x faster

ZEISS OptiRecon is an implementation of iterative reconstruction that greatly increases acquisition throughput, while optimizing image quality.
 

  • Achieve up to 4× faster scan times or enhanced image quality with equivalent throughput.
  • Benefit from this economical solution offering superior interior tomography or throughput on a broad class of samples.
     
Observe the performance of OptiRecon in a workflow performed on an electronics sample.
Observe the performance of OptiRecon in a workflow performed on an electronics sample. Analyze integration issues in a smart phone camera lens, now 4× faster. Left: Standard reconstruction: Scan time 90 minutes (1200 projections). Center: Standard reconstruction: Scan time 22 minutes (300 projections). Right: OptiRecon: Scan time 22 minutes (300 projections).
Mobile phone camera module demonstrating 4X throughput improvement with comparable image quality
Mobile phone camera module demonstrating 4X throughput improvement with comparable image quality

Slide right to left to compare:

Standard Reconstruction #300Zoom OptiRecon #300Zoom
Standard Reconstruction
OptiRecon

Application Examples

4X Throughput for Mining Powder

Flexibility for Rock Exploration 
– Image Quality vs. Throughput

4X Throughput for Battery Research

Flexibility for Battery Research
– Image Quality vs. Throughput

2X Throughput for 2.5D Semiconductor Package (50 mm x 75 mm)

Improved Image Quality for 2.5D Semiconductor Package (50 mm x 75) 

2X Throughput for Semiconductor Package

Improved Image Quality for Semiconductor Package


ZEISS PhaseEvolve for contrast enhancement

What if your image contrast of which you know is uniquely inherent to 
X-ray microscopy is overprinted by phase effects in low-medium density samples, or high resolution datasets?

  • Use PhaseEvolve, a post-processing reconstruction algorithm.
    It enables you to enhance your image contrast.
  • Perform more accurate quantitative analysis with improved contrast
    and segmentation of your results.

The image on the right shows an application of PhaseEvolve to a pharmaceutical powder sample. High resolution or low kV imaging can result in inherent material contrast being obscured by phase contrast artifacts. PhaseEvolve effectively removes phase fringes to enhance image contrast and improve segmentation results.

Standard reconstruction PhaseEvolve applied reconstruction
Standard reconstruction
PhaseEvolve applied reconstruction

Register for the upcoming AZO webinar on 7th of September

AI-driven Reconstruction Technologies Enable Next Generation XRM Imaging:
Increase Throughput and Enhance Image Quality
In case of questions or to learn how to upgrade your
3D X-ray microscope with advanced reconstruction technologies

Please fill the form below to contact us.
A member of our team will respond to you as soon as possible.

Autoloader

Increase your sample handling efficiency

Autoloader option enables you to program up to 70 samples at a time to run sequentially.
Autoloader option enables you to program up to 70 samples at a time to run sequentially.

Maximize your instrument's utilization with the optional Autoloader, available for all instruments in the ZEISS Xradia Versa series. Reduce the frequency of user interaction and increase productivity by queueing multiple jobs. Load up to 14 sample stations, which can support up to 70 samples, and set to run overnight, or across multiple days. Unprecedented mechanical stability enables high volume quantitative repetitive scanning of like samples.

Wide Field Mode

Flexibly image larger samples

Image large samples with Wide Field Mode such as this 6” stereo speaker.
Image large samples with Wide Field Mode such as this 6” stereo speaker.

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. The Xradia 620 Versa system also features WFM with the 4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.

Software

Create Efficient Workflows by Using The Simple Control System

Easily scout a region of interest and specify scanning parameters within the Scout-and-Scan Control System. Take advantage of the easy-to-use system in your central lab where users may have a variety of experience levels.

Benefit from:

  • Internal camera for sample viewing
  • Recipe control (set, save, recall)
  • Multiple energies
  • Multiple samples with Autoloader option
  • Micropositioning capability with a simple mouse click
Scout-and-Scan Control System
Scout-and-Scan Control System
Lithium-ion Battery
Lithium-ion Battery

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.

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