![]({"small":"https://images.zeiss.com/Microscopy/kr/img/semicon_korea_2021_background.ts-1611740770768.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=640&s=8beaeacb3bfec78b83befdde2af3ea05","large":"https://images.zeiss.com/Microscopy/kr/img/semicon_korea_2021_background.ts-1611740770768.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1280&s=99676d517b456c539c7cb3ab1352cdf3","medium":"https://images.zeiss.com/Microscopy/kr/img/semicon_korea_2021_background.ts-1611740770768.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=832&s=dfe9617c51be4d34c9261064d9e03bb6","full":"https://images.zeiss.com/Microscopy/kr/img/semicon_korea_2021_background.ts-1611740770768.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1920&s=c8729a10d59f5a660d685e5c8bb67f69"})
ZEISS @SEMICON Korea 2021
Accelerate New Processes for Next-generation Devices
Welcome to the ZEISS Virtual booth in lieu of SEMICON 2021
Discover and learn more about our latest microscopy solutions for the semiconductor industry.
![]({"small":"https://images.zeiss.com/Microscopy/Products/electron-microscopes/geminisem-364-460-560/gemini-3-560.ts-1605526268072.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=6%2C12%2C1897%2C1068&w=640&s=757ba5e5f8c51be43d23cc818df08138","large":"https://images.zeiss.com/Microscopy/Products/electron-microscopes/geminisem-364-460-560/gemini-3-560.ts-1605526268072.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=6%2C12%2C1897%2C1068&w=1280&s=3d8d81e55c3dd7ace546b55a924513c7","medium":"https://images.zeiss.com/Microscopy/Products/electron-microscopes/geminisem-364-460-560/gemini-3-560.ts-1605526268072.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=6%2C12%2C1897%2C1068&w=832&s=6415e37929ba52801c756af9e97e9d2b","full":"https://images.zeiss.com/Microscopy/Products/electron-microscopes/geminisem-364-460-560/gemini-3-560.ts-1605526268072.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=6%2C12%2C1897%2C1068&w=1920&s=88872ee998ad22b34b8328a581e6613f"})
![]({"small":"https://images.zeiss.com/Microscopy/resource-center/products-related/product_crossbeam_laser-fib.ts-1588167127657.png?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=0%2C6%2C997%2C562&w=640&s=ea71b4c4b4cb505ea3636c8571e96050","large":"https://images.zeiss.com/Microscopy/resource-center/products-related/product_crossbeam_laser-fib.ts-1588167127657.png?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=0%2C6%2C997%2C562&w=1280&s=47f16259e189eeb328d76a0c57c097dc","medium":"https://images.zeiss.com/Microscopy/resource-center/products-related/product_crossbeam_laser-fib.ts-1588167127657.png?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=0%2C6%2C997%2C562&w=832&s=df242362e48105f11ad008c0c6dd09e3","full":"https://images.zeiss.com/Microscopy/resource-center/products-related/product_crossbeam_laser-fib.ts-1588167127657.png?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=0%2C6%2C997%2C562&w=1920&s=8fd63f6d29aeb016386a335b4207a577"})
![]({"small":"https://images.zeiss.com/Microscopy/LandingPages/Campaign%20Landing%20Pages/global-campaigns/fy1920/materialsscience/softmaterials/product-xradia-620-versa.ts-1586510078948.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=38%2C214%2C4411%2C2486&w=640&s=32a3d10443235519689f3924f0ed291e","large":"https://images.zeiss.com/Microscopy/LandingPages/Campaign%20Landing%20Pages/global-campaigns/fy1920/materialsscience/softmaterials/product-xradia-620-versa.ts-1586510078948.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=38%2C214%2C4411%2C2486&w=1280&s=8512c14a28f0ad6dfa425a845267b276","medium":"https://images.zeiss.com/Microscopy/LandingPages/Campaign%20Landing%20Pages/global-campaigns/fy1920/materialsscience/softmaterials/product-xradia-620-versa.ts-1586510078948.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=38%2C214%2C4411%2C2486&w=832&s=bcc0af20e42b0b34f360031841e3e8c3","full":"https://images.zeiss.com/Microscopy/LandingPages/Campaign%20Landing%20Pages/global-campaigns/fy1920/materialsscience/softmaterials/product-xradia-620-versa.ts-1586510078948.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&rect=38%2C214%2C4411%2C2486&w=1920&s=337437d042a87aadb1556d20175a9e94"})
Highlights
- High-resolution semiconductor imaging and characterization: ZEISS GeminiSEM FE-SEM
- Femtosecond laser FIB that quickly finds defects inside IC packages: ZEISS Crossbeam Laser FIB-SEM
- Package structure analysis and non-destructive imaging: ZEISS Xradia Versa 3D X-ray Microscopes